Development of Thermoplastic Polymers for Thermal Nanoimprint Process

Understanding Rheology of Thermoplastic Polymers

1 AAN013 shear rate behavior. For example, gauge variation can be caused by variable post-extrusion die swell, and warpage can occur from non-uniform relaxation during cooling of an improperly formulated injection molding compound. Also, by testing at low enough shear rates so that the measurements are in the melt’s linear viscoelastic region, the data can be linked directly to the polymer’s mo...

Mechanical Behavior of Filled Thermoplastic Polymers

Thermal nanoimprint process for high-temperature fabrication of mesoscale epitaxial exchange-biased metallic wire arrays

A thermal nanoimprint process for the high-temperature (400 ◦C) fabrication of submicron, epitaxial, metallic wire arrays over areas > 1 × 1 cm2 is reported. Based on a method using an imprinted polymeric bilayer resist template that is transferred to a metallic (molybdenum) mask, this process is enabled by an appropriate undercut profile of the Mo mask. The undercut profile is obtained from a ...

A Study on Numerical Analysis of Stress Distribution for Thermal Nanoimprint Lithography Process

We investigated the deformation of the viscoelastic polymethyl methacrylene (PMMA) resist wherein a rigid SiO2 stamp with a rectangular line pattern is imprinted for thermal nano-imprint lithography (NIL). We calculated the stress distribution in the polymer resist during the molding process by finite element method (FEM). Our simulation results revealed asymmetric von Mises stress distribution...

Thermal Modeling of Ultraviolet Nanoimprint Lithography

Nanoimprint lithography (NIL) is a promising nanomanufacturing technology that offers an alternative to traditional photolithography for manufacturing next-generation semiconductor devices. This technology involves coating an ultraviolet (UV)-curable monomer layer on the substrate and then imprinting it with a template containing topography corresponding to the desired substrate features. While...